PROCEDE ET APPAREIL DESTINES A LA PRODUCTION D'UN PRODUIT ONDULE

N° de brevet: EP1879735 (A2)
Date de publication: 2008-01-23
Inventeur(s): KOHLER HERBERT B [US];
Demandeur(s): KOHLER HERBERT B [US];
Classification: B31F1/24;
N° de demande: EP20060740878 20060412 
Numéro(s) de priorité: WO2006US13578 20060412;US20060279347 20060411;US20050670505P 20050412 
A metallic copper and resin composite body manufacturing method of forming a copper wiring layer that forms an inner layer circuit, establishing an insulating layer with a resin on said wiring layer, forming via holes which expose the copper surface under the insulative layer, and depositing a metal on the copper surface that is exposed at the bottom of the via holes. The method includes a step of: removing copper oxide which forms on the surface of the copper that is exposed in the bottom of the via holes using a phosphoric acid aqueous solution with a pH between 1 and 3. The method suppresses haloing is and via holes with excellent solder bonding are formed. 



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